SureTest Series RF Test Sockets

Liberty Research’s SureTest Test Sockets use improved and patented ConnectFlexTM interposer technology to meet the challenge of testing Fine Pitch RF devices in bumped WLCSP, uBGA or QFN packages.

Standard pitch formats are available from 0.3mm to 1.0mm in package sizes to 25mm square. Contact Liberty for finer pitches.

The new SureTest Series offers unmatched electrical performance for Device Characterization and testing of RF/Microwave and mixed signal devices to greater than 40GHz.

The socket design allows Impedance matching components to be placed within 2mm of the signal contact. With signal channel path lengths of less than 0.3mm and channel Tpd of 2ps, Adjacent Channel Interference is kept to a minimum. Device tests correlate well with soldered down parts improving accuracy of data and first pass yield.

The SureTest interposers are easy to maintain and keep clean. Serviceable lifetimes in production depend largely on the handler setups, metallurgy and planarity of the contacts, cleaning frequency etc. It is expected that the interposers will perform for at least 50,000 insertions to 100,000 or more.

The interposer interface has sharp points to allow low force to break through oxide and films on the device. The board interface is non-abrasive to insure no damage to the pads of the test boards.

Using our new Molded sockets, we can provide sockets at a price attractive enough for Burn in Applications for the difficult to find CSP devices.

For Full characterization information including touchstone data for dual port transmission line models, please contact us at Liberty Research.